Raytools BT210S 0-1.5kW Fiber Laser Cutting Head

Zero focus scale recovery function to maintain accurate focus adjustment.   (Support door to door service)

Optimized optical configuration and smooth and efficient airflow design.   (Support door to door service)

The user can set continuous focus through the program to complete the fast perforation of thick plates and automatically cut plates of different thicknesses and materials.   (Support door to door service)

Adapt to QBH, QCS and etc fiber connectors, matched with various mainstream fiberlasers.Optimized  optical configuration, effectively improves the cutting speed.Modular design with easy maintenance. Skinny nozzle structure to decrease interference.Extremely light weight, small size, simple to use.   (Support door to door service)

The BM111 series laser heads are auto-focusing cutting heads for fiber laser,which are re-leased by Switzerland RAYTOOLS AG in 2017. The products are equipped with internalservo motor drive units, which use the linear mechanism to drive the focusing lens to change position in the range of about 22mm automatically. Users can use the program set-tings to achieve continuous adjustment of the focus position to complete the rapid perfora-tion of thick plates and automatic cutting of different thickness, material plates.    (Support door to door service)

1.Optimized optical configuration and smooth and efficient airflow design; 2.Automatic focusing range + 10~-12mm, adjustment accuracy 0.05mm; 3.The drawer-type of lens mount makes the replacement of protective lens more quicklyand easier; 4.The composite lens groups are used for beam collimating and focusing to obtain thebest optical quality and cutting effect;   (Support door to door service)

1. Lightweight design with fast acceleration, Optimized optical configuration, andefficient airflow design significantly improve cutting quality and efficiency. 2.Good sealing to keep the beam path clean.   (Support door to door service)

It is mainly used for high-precision marking and engraving, especially suitable for marking food and pharmaceutical packaging materials, micro-holes, glass high-speed scribing, silicon material complex pattern wafer cutting, etc. (Support door to door service)